MediaTek Confirm Specifications Helio X30, using the process of 10nm and GPU PowerVR
Producers of original China, MediaTek chipset has confirmed some expected specifications would present at the powerful chipset Helio X30 who successfully made headlines lately. It is known in an interview with Sun Chanhxu, along the Shangzu Zhu MediaTek COO discusses many things about Helio X30.
As reported Gizmochina Tuesday (26/7/2016), Zhu Shangzu States optimismenya that the chipset is the latest of this year's X-series and P-series significantly will increase the perception of consumers against MTK chipset, then they will produce high end chipset that's worth is carried on the flagship.
While on the specifications, Zhu Shangzu asserts that this will X30 Helio chipset manufactured by TSMC's manufacturing processes that use 10nm. The processor will also provide support for aggregation operators 3 baseband, Cat 10 to Paint 12 network baseband.
Here the MediaTek prefer save the ARM Mali GPU and switched to GPU PowerVR who they think can give you a better kinjerja as well as having a more efficient power consumption.
In short, the chipset chipset X30 Helio will become the second generation of the MediaTek have deca-core processors (8-core) which consists of a dual-core 2.8 GHz A73 with latest artsitektur code-named Artemis, then there are quad-core 2.2 GHz Cortex A53, and quad-core 2.0 GHz Cortex A35. While in the aspect of memory, Helio X30 will support four channels LPDDR4 of RAM, up to 8 GB of RAM, storage modules and support for UFS 2.1 standard.
But Helio X30 will not show up in the near future, because of the coming month of November they will mass produce Helio P20 which is the latest low-power chipsets and is the first chipset from MediaTek which uses the process of 16nm. It is estimated, will be carried by X30 Helio smartphone flagship until the middle of the year 2018.
As reported Gizmochina Tuesday (26/7/2016), Zhu Shangzu States optimismenya that the chipset is the latest of this year's X-series and P-series significantly will increase the perception of consumers against MTK chipset, then they will produce high end chipset that's worth is carried on the flagship.
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| MediaTek Confirm Specifications Helio X30, using the process of 10nm and GPU PowerVR |
Here the MediaTek prefer save the ARM Mali GPU and switched to GPU PowerVR who they think can give you a better kinjerja as well as having a more efficient power consumption.
In short, the chipset chipset X30 Helio will become the second generation of the MediaTek have deca-core processors (8-core) which consists of a dual-core 2.8 GHz A73 with latest artsitektur code-named Artemis, then there are quad-core 2.2 GHz Cortex A53, and quad-core 2.0 GHz Cortex A35. While in the aspect of memory, Helio X30 will support four channels LPDDR4 of RAM, up to 8 GB of RAM, storage modules and support for UFS 2.1 standard.
But Helio X30 will not show up in the near future, because of the coming month of November they will mass produce Helio P20 which is the latest low-power chipsets and is the first chipset from MediaTek which uses the process of 16nm. It is estimated, will be carried by X30 Helio smartphone flagship until the middle of the year 2018.
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