830 Snapdragon specs Revealed, use the process of 10nm and available Beginning 2017

We have previously reported the chip maker MediaTek has announced its latest high-end chipset hers named Helio X30. After the announcement, rival MediaTek, i.e. heavy Qualcomm also announced the specifications of Snapdragon 830 aimed at next year's flagship smartphone.

830 Snapdragon specs Revealed
830 Snapdragon specs Revealed
Snapdragon chipsets 830 earlier often cited on rumors that circulated formerly around the high-end handset specifications. Recently a user micro bloging Weibo had leaked information from insiders that the Snapdragon 830 will use manufacturing processes 10nm and it will be available by early next year.
Most likely, the Qualcomm Snapdragon will introduce 830 officially at the end of the year 2016. It is estimated, the next flagship smartphone will use the chipset is Samsung Galaxy S8 in 2017.
Rumors have previously speculated that Qualcomm's Snapdragon chipset will use 830 FinFET 10nm process and architecture of Kyro 200, supports 540 Adreno GPU, X 16 baseband that is allegedly capable of achieving speeds of up to 980Mbps and have a downlaod memory LPDDR4X and 4 k × 2 k/record video at 60fps.
Because of the chipsets Helio X30 of MediaTek is also rumored to be using the same process of 10nm, is not yet known which of the two chipsets that will be superior when launched later. As far as rumors circulating, excess owned Snapdragon 830 can reduce excessive power consumption and can also provide heat temperature control capability.

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